Articol #225 ianuarie 2001

Kinetic and morphological investigation of copper electrodeposition from sulfate electrolytes in the presence of an additive based on ethoxyacetic alcohol and triethyl-benzyl-ammonium chloride
Revista/Volum: MATERIALS CHEMISTRY AND PHYSICS Volume: 72 Issue: 3 Pages: 332-336 Published: DEC 1 2001 0254-0584

Varvara, S Muresan, L Nicoara, A Maurin, G. Popescu, IC

DOI: https://doi.org/10.1016/S0254-0584(01)00326-1

Articol #224 aprilie 2003

Neural networks approach for simulation of electrochemical impedance diagrams
Revista/Volum: INDIAN JOURNAL OF CHEMISTRY SECTION A-INORGANIC BIO-INORGANIC PHYSICAL THEORETICAL & ANALYTICAL CHEMISTRY Volume: 42 Issue: 4 Pages: 764-768 Published: APR 2003 0376-4710

Cristea, M Varvara, S Muresan, L Popescu, IC

Articol #223 august 2003

Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride
Revista/Volum: JOURNAL OF APPLIED ELECTROCHEMISTRY Volume: 33 Issue: 8 Pages: 685-692 Published: AUG 2003 0021-891X

Varvara, S Muresan, L Popescu, IC Maurin, G.

DOI: https://doi.org/10.1023/A:1025069004355

Articol #222 noiembrie 2004

Copper electrodeposition from sulfate electrolytes in the presence of hydroxyethylated 2-butyne-1, 4-diol
Revista/Volum: HYDROMETALLURGY Volume: 75 Issue: 1-4 Pages: 147-156 Published: NOV 2004 0304-386X

Varvara, S Muresan, L Popescu, IC Maurin, G.

DOI: https://doi.org/10.1016/j.hydromet.2004.07.006

Articol #221 ianuarie 2005

Comparative study of copper electrodeposition from sulphate acidic electrolytes in the presence of IT-85 and of its components
Revista/Volum: JOURNAL OF APPLIED ELECTROCHEMISTRY Volume: 35 Issue: 1 Pages: 69-76 Published: JAN 2005 0021-891X

Varvara, S Muresan, L Popescu, IC Maurin, G.

DOI: https://doi.org/10.1007/s10800-004-2398-1